Event Overview:

The value of Failure Analysis is fully realized when the root cause of a problem is successfully identified in a timely manner. The process of performing failure analysis often requires irreversible operations to the failing device. Every day, failure analysts are challenged to perform operations on the failing device without altering the functionality of the device or destroying the physical evidence of the defect. New products and technologies add extra dimensions to this challenge. ISTFA offers the best venue to failure analysts for acquiring the knowledge and the resources needed to take on these challenges. At ISTFA, you can learn from the experts about the tools and techniques needed for maximizing Success Rate in every aspect of Electronic Device Failure Analysis process. You can network with other failure analysts who can offer critical technical advice, and you will learn about state-of-the-art tools to meet your analysis challenges at the exposition. You can also participate as an expert presenter, teaching your novel idea or technique to the FA community.

About ASM International:

ASM International is the world's largest association of metals-centric materials engineers and scientists. We are dedicated to informing, educating, and connecting the materials community to solve problems and stimulate innovation around the world.

Co-located with ITC